Power semiconductor module



FIG. 1 is a front, top, and right side perspective view of a firstembodiment of a power semiconductor module showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a front, top, and right side perspective view of a secondembodiment of a power semiconductor module showing my new design;

FIG. 8 is a front view thereof;

FIG. 9 is a rear view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a right side view thereof; and,

FIG. 12 is a left side view thereof.

The features shown in broken lines in the drawings depict portions ofthe article that form no part of the claimed design. The dash-dottedlines denote the boundary of the claim and form no part of the claimeddesign.

CLAIM The ornamental design for a power semiconductor module, as shownand described.